Dry Adhesives

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Dry Adhesives. Setex DA

Setex® DA Dry Adhesive are repeatable, residue-free, non-tacky tapes. These tapes can be used in semiconductor parts handling, glass handling, robotics end effectors, packaging and hanging/mounting to smooth surfaces.

A revolutionary new dry adhesive technology!

nanoGriptech’s Setex® is the world’s first commercial implementation of dry adhesive technology—enabling a pressure-sensitive adhesive approach, but one that is dry, repeatable, and residue-free. Setex dry adhesive solutions are for leading product designers and manufacturing engineers who are frustrated with the limitations of current non-repeatable, tacky and residue-prone alternatives. Currently available as a custom solution, Setex dry adhesive solutions are provided across a wide range of materials.

Attributes and Benefits include:


Repeatability: Setex DA provides repeatable adhesive performance, unlike PSAs that lose their strength over time.


Residue-Free: Setex DA does not leave any sticky adhesive residues when it is removed from a surface.


Dry / Glue-free / Non-tacky: Setex DA is completely dry, providing amazing adhesion without sticky chemical bonds or lint-attracting hooks (or mushrooms).


Customizable Performance: Setex DA can be designed with varying shear and peel strengths to fit your application’s needs.

The Science

Setex DA is supplied with fiber tips in contact with a release film. This film should be removed before evaluation of the samples and replaced when samples are not in use.

The strength of the dry adhesive is dependent on the number of microfiber tips in contact with the surface and the contact time. We recommend applying with firm pressure to achieve good surface contact.

Shear and Peel Strength

Product Comparisons
5lb pre-load, 1 minute dwell time, retraction speed of 1mm/s, on stainless steel substrate.

Performance over 1000 peel cycles

Setex DA Dry Adhesive Cycle Chart
Setex DA Close up
Setex DA microscopic

nanoGriptech’s Setex dry adhesive is seen in this video picking and placing 1mm silicon wafers, and delivering them to another carrier. This technology enables the picking and placing of even the most delicate parts without leaving residue for thousands of cycle