Setex GeckoTape™ is a line of repeatable, residue-free, non-tacky tapes. These customized adhesive solutions can be used in applications such as semiconductor parts handling, glass handling, robotics end effectors, packaging and mounting to smooth surfaces.
nanoGriptech’s® Setex GeckoTape is the world’s first commercial implementation of dry adhesive technology, enabling a pressure-sensitive adhesive solution that is dry, repeatable and residue-free.
Setex GeckoTape is ideal for leading product designers and manufacturing engineers who are frustrated with the limitations of current non-repeatable, tacky and residue-prone alternatives. Currently available as a custom solution, Setex GeckoTape can be manufactured in a wide range of consistencies.
Repeatability: Setex GeckoTape provides repeatable adhesive performance, unlike PSAs that lose their strength over time.
Residue-Free: Setex GeckoTape does not leave any sticky adhesive residues when it is removed from a surface.
Dry / Glue-free / Non-tacky: Setex GeckoTape is completely dry, providing exceptionally strong adhesion without sticky chemical bonds or lint-attracting hooks (or mushrooms).
Customizable Performance: Setex GeckoTape can be designed with varying shear and peel strengths to fit your application’s needs.
Setex GeckoTape has fiber tips that are in contact with a release film. This film should be removed before evaluation of the samples and replaced when samples are not in use.
The strength of the dry adhesive is dependent on the number of microfiber tips in contact with the surface and the contact time. We recommend applying with firm pressure to achieve optimal surface contact.
|DA 910/ DA 110||High strength dry adhesive microfiber||30-40||1-2||0.6-0.8|
|DA 210||Medium strength dry adhesive microfiber||20-30||0.5||0.2-0.4|
|DA 310||Low strength dry adhesive microfiber||10||NA||NA|
5lb pre-load, 1 minute dwell time, retraction speed of 1mm/s, on stainless steel substrate.
nanoGriptech’s Setex GeckoTape is seen in this video picking and placing 1mm silicon wafers and delivering them to another carrier surface. This technology enables the picking and placing of the most valuable semiconductor parts for thousands of cycles without leaving a residue.