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Semiconductor manufacturers are searching for a material to use on equipment fixturing surfaces to handle silicon wafers. Current solutions are time consuming, resulting in a high scrap rate due to damaged parts and residue. By changing only the shape of the microstructures, the strength of Setex™ DA can be finely tuned to the shear and peel strength that the part handling operation requires, enabling the picking and placing of even the most delicate parts without leaving residue for thousands of cycles.
Current adhesives leave residue, increasing time required when replacing pads. This manual cleaning process simply adds costs, versus value. Further, such adhesives typically provide limited repeatability. Costs increase as a pad is used once.
Setex™ DA is supplied with fiber tips in contact with a release film. This film should be removed before evaluation of the samples and replaced when samples are not in use.
The strength of the dry adhesive is dependent on the number of microfiber tips in contact with the surface and the contact time. We recommend applying with firm pressure to achieve good surface contact.
Many manufacturing environments need gripping and friction materials that not only enable parts movement, handling and fixturing, but also are dry, residue-free and able to secure very smooth (and therefore tough-to-hold) parts. Solutions are limited, especially for new material coatings that designers want to use.
nanoGriptech’s Setex™ dry adhesive is seen in this video picking and placing 1mm silicon wafers, and delivering them to another carrier. This technology enables the picking and placing of even the smallest, most delicate parts, over repeated cycling.