Interested in our products? Contact us to learn more.
Semiconductor manufacturers are searching for a material to use on equipment fixturing surfaces to handle silicon wafers. Current solutions are time consuming, resulting in a high scrap rate due to damaged parts and residue. By changing only the shape of the microstructures, the strength of Setex Gecko TapeTM can be finely tuned to the shear and peel strength that the part handling operation requires, enabling the picking and placing of even the most delicate parts without leaving residue for thousands of cycles.
Current adhesives leave residue resulting in killer defects on fabricated wafers and significant yield losses. This deficiency increases time required to replace pads, resulting in lower throughput in production. This manual cleaning process adds costs without adding value. Furthermore, such adhesives typically offer limited repeatability.
Setex Gecko Tape has fiber tips that are in contact with a release film. This film should be removed before evaluation of samples and be replaced when samples are not in use.
The strength of Setex Gecko Tape depends on the number of microfiber tips in contact with the surface and amount of contact time. We recommend applying microfiber tips with firm pressure to achieve optimal surface contact.
|GT 910/ GT 110||High strength dry adhesive microfiber||30-40||1-2||0.6-0.8|
|GT 210||Medium strength dry adhesive microfiber||20-30||0.5||0.2-0.4|
|GT 310||Low strength dry adhesive microfiber||10||NA||NA|
5lb pre-load, 1 minute dwell time, retraction speed of 1mm/s, on stainless steel substrate.
Many manufacturing environments need gripping and friction materials that enable rapid parts movement, as well as handling and fixturing, and are also dry, residue-free and able to secure very smooth, tough-to-hold parts. Solutions are limited, especially for new material coatings that designers want to use.
In this demonstration, Setex Gecko Tape Dry Adhesive enables a wafer wand to cleanly manipulate a semiconductor wafer.